Lipotoloho XQ6SLX150 (Lethathamo le felletseng la chelete)

paramethara:

Tlhaloso e Akaretsang :
Li-FPGA tsa Xilinx® 7 li na le malapa a mane a FPGA a sebetsanang le mefuta e mengata ea litlhoko tsa sistimi, ho tloha ho theko e tlase, ntho e nyane,
Likopo tse theko e boima, tse phahameng haholo ho bandwidth ea khokahanyo e phahameng ea pheletso, matla a kelello, le bokhoni ba ho sebetsana le mats'oao bakeng sa tse batloang haholo.
dikopo tse sebetsang hantle haholo.Li-FPGA tse 7 li kenyelletsa:
• Lelapa la Spartan®-7: E lokiselitsoe litjeho tse tlase, matla a tlase, le holimo
Mosebetsi oa I/O.E fumaneha ka theko e tlase, e nyane haholo
sephutheloana bakeng sa sebaka se senyenyane sa PCB.
• Lelapa la Artix®-7: E lokiselitsoe lisebelisoa tsa motlakase tse tlase tse hlokang serial
li-transceivers le DSP e phahameng le logic throughput.E fana ka tse tlase
kakaretso ea litšenyehelo tsa thepa bakeng sa ho kenya chelete e ngata, e nang le litšenyehelo tse ngata
lits'ebetso.
• Lelapa la Kintex®-7: E lokiselitsoe ho sebetsa hantle ka theko ka 2X
ntlafatso ha e bapisoa le moloko o fetileng, e nolofalletsang sehlopha se secha
ea li-FPGA.
• Lelapa la Virtex®-7: E ntlafalitsoe bakeng sa ts'ebetso e phahameng ea sistimi le
bokhoni ka ntlafatso ea 2X ts'ebetsong ea sistimi.Phahameng ka ho fetisisa
lisebelisoa tsa bokhoni tse nolofalitsoeng ke silicon interconnect (SSI)
thekenoloji.
E hahiloe holim'a theknoloji ea morao-rao, ea ts'ebetso e phahameng, e tlaase (HPL), 28 nm, high-k metal heke (HKMG) theknoloji ea ts'ebetso, 7 series FPGAs e nolofalletsa
keketseho e ke keng ea bapisoa ea ts'ebetso ea tsamaiso ka 2.9 Tb / s ea I / O bandwidth, 2 milione logic cell capacity, le 5.3 TMAC / s DSP, ha e ntse e ja 50% tlase
matla ho feta lisebelisoa tsa moloko o fetileng ho fana ka mefuta e meng e lokiselitsoeng ka botlalo ho ASSPs le ASICs.
Kakaretso ea 7 Series FPGA Features
• Maikutlo a FPGA a ts'ebetso e phahameng a ipapisitseng le chebahalo ea 'nete ea 6-input
thekenoloji ea up table (LUT) e ka lokisoang joalo ka mohopolo o abuoang.
• 36 Kb dual-port block RAM e nang le logic e hahelletsoeng ka har'a FIFO bakeng sa data ea on-chip
buffering.
• Theknoloji ya tshebetso e phahameng ya SelectIO™ e tshehetsang DDR3
likhokahano ho fihla ho 1,866 Mb/s.
• Khokahano ea serial ea lebelo le phahameng le li-transceivers tse hahiloeng ka har'a li-multi-gigabit
ho tloha ho 600 Mb/s ho isa ho max.litefiso tsa 6.6 Gb/s ho fihla ho 28.05 Gb/s, tse fanang ka a
mokhoa o khethehileng oa matla a tlase, o ntlafalitsoeng bakeng sa likhokahano tsa chip-to-chip.
• Sehokelo sa analoge se lokisehang (XADC), se kopanyang tse peli
12-bit 1MSPS analog-to-digital converters e nang le on-chip thermal le
li-sensor tsa phepelo.
• Lilae tsa DSP tse nang le 25 x 18 multiplier, 48-bit accumulator, le pre-adder
bakeng sa ho sefa ka tšebetso e phahameng, ho kenyeletsoa symmetric e ntlafalitsoeng
coefficient filtering.
• Lithaele tse matla tsa taolo ea oache (CMT), tse kopanyang karolo e notletsoeng
loop (PLL) le molaoli oa oache oa mofuta o tsoakiloeng (MMCM) o thibela holimo
ho nepahala le jitter e tlase.
• Kenya tšebetsong e kentsoeng ka potlako ka processor ea MicroBlaze™.
• Boloko bo kopaneng ba PCI Express® (PCIe), ho fihla ho x8 Gen3
Liqapi tsa Endpoint le Root Port.
• Mefuta e mengata e fapaneng ea likhetho tsa tlhophiso, ho kenyeletsoa tšehetso bakeng sa
mehopolo ea thepa, 256-bit AES encryption e nang le HMAC/SHA-256
netefatso, le ho lemoha le ho lokisa SEU e hahelletsoeng.
• Theko e tlase, wire-bond, bare-die flip-chip, le lets'oao le phahameng la botšepehi
chip packaging e fanang ka phallo e bonolo pakeng tsa litho tsa lelapa ho
sephutheloana se tšoanang.Liphutheloana tsohle li fumaneha ka Pb-mahala 'me li khethiloe
liphutheloana ka khetho ea Pb.
• E etselitsoe ts'ebetso e phahameng le matla a tlase ka 28nm,
HKMG, HPL process, 1.0V core voltage process technology le
0.9V core voltage khetho bakeng sa matla a tlase le ho feta.