Thepa ea Sehlahisoa
| MOFUTA | HLALISA |
| sehlopha | Potoloho e Kopanetsoeng (IC) E kenyelelitsoe - li-Microcontroller |
| moetsi | Litlhaloso tsa likarolo tsa NXP USA Inc. |
| letoto | MPC57xx |
| Sephutheloana | terei |
| boemo ba sehlahisoa | e teng thepeng e teng ka lebenkeleng |
| processor ea mantlha | e200z2, e200z4 |
| Tlhaloso ea kernel | 32-bit dual core |
| lebelo | 80MHz / 160MHz |
| Khokahano | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG |
| Pheripherals | DMA, LVD, POR, WDT |
| Nomoro ea I / O | 246 |
| Bokhoni ba polokelo ea lenaneo | 4MB (4M x 8) |
| Mofuta oa memori ea lenaneo | kganya |
| Bokhoni ba EEPROM | - |
| Boholo ba RAM | 512K x 8 |
| Voltage - Phepelo ea Matla (Vcc/Vdd) | 3V ~ 5.5V |
| data converter | A/D 80x10b, 64x12b |
| Mofuta oa Oscillator | ka hare |
| Mocheso oa ho sebetsa | -40°C ~ 105°C (TA) |
| mofuta oa ho kenya | Mofuta oa Mount Mount |
| Sephutheloana/Sekoahelo | 324-LBGA |
| Sephutheloana sa Sesebelisoa sa Bafani | 324-MAPBGA (19×19) |
| Nomoro ea mantlha ea sehlahisoa | SPC5747 |
Litokomane le Mecha ea litaba
| MOSEBETSI MOFUTA | LINKI |
| Boitsebiso ba tikoloho | NXP USA Inc RoHS3 Cert NXP USA Inc REACH211 Cert |
| Lihlahisoa tse hlahisitsoeng | Mochini o rekisoang oa litekete |
| Seboka sa PCN / Mohloli | Sebaka sa Mult Dev A/T 28/Apr/2021 |
| Sephutheloana sa PCN | Mult Dev Pkg Seal 15/Dec/2020 Lintlafatso tsohle tsa Dev Label 15/Dec/2020 |
Tikoloho le Karolelano ea Thepa e Ntle
| LITŠOANTŠISO | HLALISA |
| Boemo ba RoHS | E lumellana le litlhaloso tsa ROHS3 |
| Boemo ba Sensitivity ea Mongobo (MSL) | 3 (lihora tse 168) |
| FIHLELA boemo | Lihlahisoa tse sa fihlelleheng |
| PHOLOHANG | 5A992C |
| HTSUS | 8542.31.0001 |
