thepa ea lihlahisoa
MOFUTA
HLALISA
sehlopha
Potoloho e Kopanetsoeng (IC)
E kenyelelitsoe - Sistimi ho Chip (SoC)
moetsi
AMD Xilinx
letoto
Zynq®-7000
Sephutheloana
terei
Boemo ba Sehlahiswa
e teng thepeng e teng ka lebenkeleng
Meaho
MCU, FPGA
processor ea mantlha
ARM® Cortex®-A9 MPCore™ e le 'ngoe e nang le CoreSight™
Boholo ba Flash
-
Boholo ba RAM
256KB
Pheripherals
DMA
Khokahano
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
lebelo
667MHz
tšobotsi e ka sehloohong
Artix™-7 FPGA, 23K lisele tsa kelello
Mocheso oa ho sebetsa
0°C ~ 85°C (TJ)
Sephutheloana/Sekoahelo
400-LFBGA, CSPBGA
Sephutheloana sa Sesebelisoa sa Bafani
400-CSPBGA (17×17)
I/O palo
100
Nomoro ea mantlha ea sehlahisoa
XC7Z007
Media le Downloads
MOSEBETSI MOFUTA
LINKI
Litlhaloso
Zynq-7000 All Programmable SoC Overview
Tlhaloso ea Zynq-7000 SoC
Tataiso ea mosebelisi ea Zynq-7000
faele ea video
Kenyelletso ea Cora Z7
Boitsebiso ba tikoloho
Setifikeiti sa Xiliinx RoHS
Xilinx REACH211 Cert
Lihlahisoa tse hlahisitsoeng
TE0723 ArduZynq Series le Xilinx Zynq®-Z-7010/Z-7007S SoCs
All Programmable Zynq®-7000 SoC
Corz Z7: Likhetho tsa Zynq-7000 Single- le tse peli-Core bakeng sa nts'etsopele ea Arm®/FPGA SoC
EDA/CAD ea mohlala
XC7Z007S-1CLG400C ka SnapEDA
XC7Z007S-1CLG400C ke Mohlokomeli oa Libuka oa Ultra
Tlhophiso ea Tikoloho le Liromello
LITŠOANTŠISO
HLALISA
Boemo ba RoHS
E lumellana le litlhaloso tsa ROHS3
Boemo ba Sensitivity ea Mongobo (MSL)
3 (lihora tse 168)
FIHLELA boemo
Lihlahisoa tse sa fihlelleheng
ECCN
3A991D
HTSUS
8542.39.0001
