thepa ea lihlahisoa
MOFUTA
HLALISA
sehlopha
Potoloho e Kopanetsoeng (IC)
E kenyelelitsoe - Sistimi ho Chip (SoC)
moetsi
AMD Xilinx
letoto
Zynq®-7000
Sephutheloana
terei
Boemo ba Sehlahiswa
e teng thepeng e teng ka lebenkeleng
Meaho
MCU, FPGA
processor ea mantlha
Dual ARM® Cortex®-A9 MPCore™ e nang le CoreSight™
Boholo ba Flash
-
Boholo ba RAM
256KB
Pheripherals
DMA
Khokahano
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
lebelo
800MHz
tšobotsi e ka sehloohong
Kintex™-7 FPGA, 350K lisele tsa kelello
Mocheso oa ho sebetsa
-40°C ~ 100°C (TJ)
Sephutheloana/Sekoahelo
676-BBGA, FCBGA
Sephutheloana sa Sesebelisoa sa Bafani
676-FCBGA (27×27)
I/O palo
130
Nomoro ea mantlha ea sehlahisoa
XC7Z045
Media le Downloads
MOSEBETSI MOFUTA
LINKI
Litlhaloso
Zynq-7000 All Programmable SoC Overview
Lethathamo la lintlha tsa XC7Z030,35,45,100
Tataiso ea mosebelisi ea Zynq-7000
Li-module tsa koetliso ea lihlahisoa
Powering Series 7 Xilinx FPGAs e nang le TI Power Management Solutions
Boitsebiso ba tikoloho
Setifikeiti sa Xiliinx RoHS
Xilinx REACH211 Cert
Lihlahisoa tse hlahisitsoeng
All Programmable Zynq®-7000 SoC
Moqapi oa PCN / Tlhaloso
Letšoao la Sehlahisoa Chg 31/Oct/2016
Mult Dev Material Chg 16/Dec/2019
Sephutheloana sa PCN
Multi Devices 26/Jun/2017
Errata
Zynq-7000 Errata
Tlhophiso ea Tikoloho le Liromello
LITŠOANTŠISO
HLALISA
Boemo ba RoHS
E lumellana le litlhaloso tsa ROHS3
Boemo ba Sensitivity ea Mongobo (MSL)
3 (lihora tse 168)
FIHLELA boemo
Lihlahisoa tse sa fihlelleheng
ECCN
3A991D
HTSUS
8542.39.0001
