thepa ea lihlahisoa
MOFUTA
HLALISA
sehlopha
Potoloho e Kopanetsoeng (IC)
E kenyelelitsoe - Sistimi ho Chip (SoC)
moetsi
AMD Xilinx
letoto
Zynq® UltraScale+™ MPSoC CG
Sephutheloana
terei
Boemo ba Sehlahiswa
e teng thepeng e teng ka lebenkeleng
Meaho
MCU, FPGA
processor ea mantlha
Dual Core ARM® Cortex®-A53 MPCore™ e nang le CoreSight™, Dual Core ARM® Cortex™-R5 e nang le CoreSight™
Boholo ba Flash
-
Boholo ba RAM
256KB
Pheripherals
DMA, WDT
Khokahano
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
lebelo
533MHz, 1.3GHz
tšobotsi e ka sehloohong
Zynq® UltraScale+™ FPGA, 103K+ lisele tsa kelello
mocheso o sebetsang
-40°C ~ 100°C (TJ)
Sephutheloana/Sekoahelo
784-BFBGA, FCBGA
Sephutheloana sa Sesebelisoa sa Bafani
784-FCBGA (23×23)
I/O palo
252
Nomoro ea mantlha ea sehlahisoa
XCZU2
Media le Downloads
MOSEBETSI MOFUTA
LINKI
Litlhaloso
Kakaretso ea Zynq UltraScale+ MPSoC
Boitsebiso ba tikoloho
Setifikeiti sa Xiliinx RoHS
Xilinx REACH211 Cert
EDA/CAD ea mohlala
XCZU2CG-2SFVC784I ka SnapEDA
Tlhophiso ea Tikoloho le Liromello
LITŠOANTŠISO
HLALISA
Boemo ba RoHS
E lumellana le litlhaloso tsa ROHS3
Boemo ba Sensitivity ea Mongobo (MSL)
4 (lihora tse 72)
FIHLELA boemo
Lihlahisoa tse sa fihlelleheng
ECCN
5A002A4 XIL
HTSUS
8542.39.0001
