Ka la 9 Loetse, ka nako ea lehae, CEO oa Intel Kissinger o phatlalalitse hore o tla tsetela lidolara tse libilione tse 20 ho aha feme e ncha e kholo ea liphaephe Ohio, United States.Ena ke karolo ea leano la Intel's IDM 2.0.Leano lohle la matsete le ka holimo ho $100 limilione tse likete.Fektheri e ncha e lebelletsoe ho hlahisoa ka bongata ka 2025. Ka nako eo, ts'ebetso ea "1.8nm" e tla khutlisetsa Intel boemong ba moetapele oa semiconductor.
Ho tloha ha e e-ba CEO oa Intel ka Hlakola selemong se fetileng, Kissinger o khothalelitse ka matla kaho ea lifeme United States le lefats'e ka bophara, tseo bonyane lidolara tse limilione tse likete tse 40 tsa US li tsetelitsoeng United States.Selemong se fetileng, o tsetetse US $20 bilione ho la Arizona ho aha feme ea liphaephe.Lekhetlong lena, o boetse a tsetela US $ 20 bilione Ohio, hape a haha fektheri e ncha ea ho tiisa le ho etsa liteko New Mexico.
Intel e tsetela lidolara tse ling tse limilione tse likete tse 20 ho aha lifeme tse peli tsa chip.Morena oa theknoloji ea "1.8nm" oa khutla
Feme ea Intel hape ke feme e kholo ea semiconductor chip e sa tsoa hahuoa United States kamora ho fetisoa ha sekoloto sa chip sa lidolara tse limilione tse likete tse 52.8.Ka lebaka lena, mopresidente oa United States le eena o ile a ea moketeng oa ho qala, hammoho le ’musisi oa Ohio le liofisiri tse ling tse phahameng tsa mafapha a sebaka seo.
Intel e tsetela lidolara tse ling tse limilione tse likete tse 20 ho aha lifeme tse peli tsa chip.Morena oa theknoloji ea "1.8nm" oa khutla
Intel's chip production base e tla etsoa ka lifeme tse peli tsa wafer, tse ka nkang lifeme tse ka bang robeli le ho ts'ehetsa lits'ebetso tsa ts'ehetso ea tikoloho.E akaretsa sebaka se ka bang 1000 acres, ke hore, 4 square kilometers.E tla theha mesebetsi e 3000 e lefang haholo, mesebetsi e 7000 ea kaho, le mashome a likete a mesebetsi ea tšebelisano ea phepelo ea thepa.
Lifeme tsena tse peli tsa wafer li lebelletsoe ho hlahisa ka bongata ka 2025. Intel ha ea ka ea bua ka ho toba boemo ba feme, empa Intel e boletse pejana hore e tla tseba ts'ebetso ea 5-generation CPU nakong ea lilemo tse 4, 'me e tla hlahisa 20a ka bongata. le 18a two generation process ka 2024. Ka hona, feme mona le eona e lokela ho hlahisa tšebetso ea 18a ka nako eo.
20a le 18a ke mekhoa ea pele ea lefats'e ea chip ho fihla boemong ba EMI, e lekanang le mekhoa ea 2nm le 1.8nm ea metsoalle.Ba tla boela ba thakgole dithekenoloji tse pedi tsa thekenoloji tsa Intel black, ribone FET le powervia.
Ho latela Intel, ribbonfet ke ts'ebetsong ea Intel ea heke ho potoloha li-transistors.E tla fetoha mohaho oa pele oa mochine o mocha oa transistor ho tloha ha k'hamphani e qala ho hlahisa FinFET ka 2011. Theknoloji ena e potlakisa lebelo la ho fetola transistor 'me e finyella lebelo le tšoanang la ho khanna joaloka mohaho oa multifin, empa e nka sebaka se senyenyane.
Powervia ke Intel e ikhethang ebile ke marang-rang a pele a morao-rao a phetisetso ea matla a indasteri, a ntlafatsang phetisetso ea mats'oao ka ho felisa tlhoko ea phepelo ea matla le matla.
Nako ea poso: Sep-12-2022