thepa ea lihlahisoa
MOFUTA HLALOSA
sehlopha sa Integrated Circuit (IC)
Memori - Configuration PROM bakeng sa FPGA
moetsi oa AMD Xilinx
letoto -
Lisebelisoa tsa liphaephe tsa pakete
Boemo ba Sehlahisoa bo emisitsoe
Mofuta o ka lokisoang o ka lokisoa tsamaisong
polokelo 2Mb
Voltage - E tsamaisoa ke 3V ~ 3.6V
Mocheso oa ho sebetsa -40°C ~ 85°C
mofuta oa ho kenya Surface Mount Type
Sephutheloana/Enclosure 20-TSSOP (0.173″, 4.40mm bophara)
Sephutheloana sa Sesebelisoa sa Bafani 20-TSSOP
Nomoro ea mantlha ea sehlahisoa XCF02
tlaleha phoso
Patlisiso e ncha ea Parametric
Media le Downloads
LINKI YA MOFUTA WA MOSEBETSI
Litlhaloso tsa XCFxx(S,P) Platform Flash PROMS
Lintlha tsa tikoloho Xilinx REACH211 Cert
Setifikeiti sa Xiliinx RoHS
Phetoho ea Sehlahisoa sa PCN/Ho Khaotsoa ha Mult Dev EOL 17/May/2021
Qetello ea Bophelo 10/JAN/2022
Kopano ea PCN / Sebaka sa Mohloli Chg 22/Feb/2016
Tlhophiso ea Tikoloho le Liromello
LIEKETSENG HLALISA
Boemo ba RoHS bo lumellana le litlhaloso tsa ROHS3
Boemo ba Kutloelo-bohloko ea Mongobo (MSL) 3 (lihora tse 168)
FIHLELA boemo Lihlahisoa tse sa fihlelleheng
ECCN 3A991B1B1
HTSUS 8542.32.0071
