thepa ea lihlahisoa
MOFUTA HLALOSA
sehlopha sa Integrated Circuit (IC)
Memori - Configuration PROM bakeng sa FPGA
moetsi oa AMD Xilinx
letoto -
Terei ea sephutheloana
Boemo ba Sehlahisoa bo emisitsoe
Mofuta o ka lokisoang o ka lokisoa tsamaisong
polokelo ea 8Mb
Voltage - E tsamaisoa ke 1.65V ~ 2V
Mocheso oa ho sebetsa -40°C ~ 85°C
mofuta oa ho kenya Surface Mount Type
Pakete / Enclosure 48-TFBGA, CSPBGA
Sephutheloana sa Sesebelisoa sa Bafani 48-CSP (8×9)
Nomoro ea mantlha ea sehlahisoa XCF08
tlaleha phoso
Patlisiso e ncha ea Parametric
Media le Downloads
LINKI YA MOFUTA WA MOSEBETSI
Litlhaloso tsa XCFxx(S,P) Platform Flash PROMS
Tataiso ea mosebelisi ea Platform Flash PROM
Platform Flash PROM Revisions
Lintlha tsa tikoloho Setifikeiti sa Xiliinx RoHS
Xilinx REACH211 Cert
Phetoho ea Sehlahisoa sa PCN / Ho Khaotsoa ha Bophelo 10/JAN/2022
Mult Dev EOL 17/May/2021
HTML Specifications Platform Flash PROM User Guide
Platform Flash PROM Revisions
Tlhophiso ea Tikoloho le Liromello
LIEKETSENG HLALISA
Boemo ba RoHS Ha bo lumellane le RoHS
Boemo ba Kutloelo-bohloko ea Mongobo (MSL) 3 (lihora tse 168)
FIHLELA boemo Lihlahisoa tse sa fihlelleheng
ECCN 3A991B1B1
HTSUS 8542.32.0071
